Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review
计算机科学
工程类
作者
Guoliang Chen,Guiqi Wang,Zhenzhen Wang,Lijun Wang
标识
DOI:10.1109/icocn67308.2025.11145490
摘要
This paper discusses advanced CPO technologies and outlines future directions for design, fabrication using femtosecond laser and glass, which is a promising material to address Si issues such as warpage, reliabilities and thermal dissipation.