Lv41
484 积分 2023-06-20 加入
Optimization of Cu protrusion of wafer-to-wafer hybrid bonding for HBM packages application
6小时前
已完结
Effects of surface treatments for the adhesion improvement between Cu and SiCN in BEOL interconnect
6天前
已完结
A Review: Inductively Coupled Plasma Reactive Ion Etching of Silicon Carbide
6天前
已完结
Highly selective etching of SiNx over SiO2 using ClF3/Cl2 remote plasma
7天前
已完结
In Situ Monitoring of Etching Characteristic and Surface Reactions in Atomic Layer Etching of SiN Using Cyclic CF4/H2 and H2 Plasmas
7天前
已完结
Cryogenic atomic layer etching of SiO2 using CH2F2/Ar plasma for improved process window for nanoscale fabrication
8天前
已完结
Modeling of plasma processing reactors: review and perspective
1个月前
已完结
Mechanism of Microtrench Generation in Etching of Wiring Trench on SiO2 Layer: Proposal of Simulation Model using High-Pressure Etching Gas
1个月前
已完结
Optimization of Metal Line Thickness & CD and Effect on RC Delay
1个月前
已完结
Boron-doped amorphous carbon deposited by DC sputtering for a hardmask: Microstructure and dry etching properties
1个月前
已完结
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