| 标题 |
Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of the Taiwan Institute of Chemical Engineers 作者:Fengyi WANG; Ziwen LV; Linxiao Sun; Hongtao CHEN; Mingyu LI 出版日期:2023 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)