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910 积分 2026-05-18 加入
The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF6/O2 Cycles with Excellent 3D Profile Control at Room Temperature
7天前
已完结
A molecular dynamics investigation of fluorocarbon based layer-by-layer etching of silicon and SiO2
9天前
已完结
Insights into different etching properties of continuous wave and atomic layer etching processes for SiO2 and Si3N4 films using voxel-slab model
9天前
已完结
Molecular dynamics simulation of oxide-nitride bilayer etching with energetic fluorocarbon ions
9天前
已关闭
A molecular dynamics investigation of fluorocarbon based layer-by-layer etching of silicon and SiO2
18天前
已完结
Molecular dynamics study of SiO2 nanohole etching by fluorocarbon ions
18天前
已完结
Etch-stop mechanisms in plasma-enhanced atomic layer etching of silicon nitride: A molecular dynamics study
18天前
已完结
Autonomous hybrid optimization of a SiO2 plasma etching mechanism
19天前
已完结
Charging of pattern features during plasma etching
29天前
已完结
Investigation of feature orientation and consequences of ion tilting during plasma etching with a three-dimensional feature profile simulator
1个月前
已完结