| 标题 |
Oxidation-resistant bimodal copper interconnects on LCP substrates via in-situ chemically-assisted nano-soldering |
| 网址 | |
| DOI | |
| 其它 |
期刊:Applications of Surface Science 作者:Fei Qin; Hetian Hou; Yuhao Zhang; Bin Lin; Tianyi Sui 出版日期:2026-01-01 |
| 求助人 | |
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(2025-6-4)