| 标题 |
Stress analysis and characterization of TEOS-based PECVD fabricated SiO2 solid films after thermal annealing |
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| DOI | |
| 其它 |
期刊:Semiconductor Science and Technology 作者:Kun Zhang; Jun Chen; Xiaomin Cheng; Xiangshui Miao; Zhiliang Xia 出版日期:2025-09-09 |
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(2025-6-4)