| 标题 |
Sputtered ultra-thin Au coating on Cu wire: enhancing ball formation and reliability for advanced wire bonding |
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| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Bo-Chin Huang; Bo-Ding Wu; Chien-Te Huang; Fei-Yi Hung; Jie-Yun Zheng 出版日期:2025-05-01 |
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(2025-6-4)