| 标题 |
High-temperature Ga–P-modified Sn–0.7Cu-based solder: oxidation resistance and solderability |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Chen Liu; Lingxue Guo; Hongbo Lu; Qin Wang; Shanshan Cai; et al 出版日期:2025-02-01 |
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(2025-6-4)