| 标题 |
Interfacial microstructure and mechanical properties of aluminum-copper-silicon diffusion bonded joints
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| DOI |
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| 其它 | Feng AH, Wang D, Ma XL (2012) Interfacial microstructure and mechanical properties of aluminum-copper-silicon diffusion bonded joints. Mater Des 33:155–162 |
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(2025-6-4)