| 标题 |
Achieving robust and low thermal resistance polycrystalline diamond-Si integration by ultra-thin film AuIn bonding |
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| DOI | |
| 其它 |
期刊:Diamond and Related Materials 作者:Zeming Tao; Keqing Ouyang; Jinbao Zhang; Dongchen Fan; Guangyao Li; et al 出版日期:2026-08-01 |
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(2025-6-4)