| 标题 |
Enhancing mechanical properties and electrical conductivity of Cu-Ti-Si alloys through tailored thermomechanical processing |
| 网址 | |
| DOI | |
| 其它 |
期刊:Composites Communications 作者:Guosheng Chen; Cailiu Yin; Xinjiang Zhang; Chengcheng Peng; Zhengwei Liu; et al 出版日期:2026-01-30 |
| 求助人 | |
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(2025-6-4)