| 标题 |
Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges |
| 网址 | |
| DOI |
10.1115/1.4064354
doi
|
| 其它 |
期刊:Journal of Electronic Packaging 作者:Y. W. Wang; M. Y. Tsai; Y. S. Chou 出版日期:2024-01-08 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人或该文件上传人下载。 |
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(2025-6-4)