| 标题 |
Infusion of 2D Hexagonal Boron Nitride Nanosheets into Glass Dielectric PCBs for Enhanced Fracture Toughness, Dielectric Performance, and Solder Wettability in Semiconductor Packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:ACS Applied Engineering Materials 作者:Anusha Geesala; Laxmi Kanth Thangi; Bill Merka; Yashwanth Arcot; Mustafa E. S. Akbulut 出版日期:2026-04-04 |
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(2025-6-4)