| 标题 |
The Effect of Post Cooling Time of Single Wafer Annealing on TDDB Reliability |
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| DOI | |
| 其它 |
期刊:2025 Conference of Science and Technology of Integrated Circuits (CSTIC) 作者:DongLiang Gao; CunZhe He; JinWang Geng; Xuan Liu 出版日期:2025-03-24 |
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(2025-6-4)