| 标题 |
Construction of robust Cu-N4-Pt bond connecting Cu single atoms support and Pt for augmented electrocatalytic process |
| 网址 | |
| DOI | |
| 其它 |
期刊:Chemical Engineering Journal 作者:Huihui Jin; Bingshuai Liu; Pengxia Ji; Zhengying Li; Daping He 出版日期:2024-02-16 |
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(2025-6-4)