| 标题 |
A 0.296pJ/bit 17.9Tb/s/mm2 Die-to-Die Link in 5nm/6nm FinFET on a 9μm-Pitch 3D Package Achieving 10.24Tb/s Bandwidth at 16Gb/s PAM-4 |
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| 其它 |
期刊:2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) 作者:Mu-Shan Lin; Chien-Chun Tsai; Shenggao Li; Tze-Chiang Huang; Wen-Hung Huang; et al 出版日期:2024-06-16 |
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(2025-6-4)