| 标题 |
Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage |
| 网址 | |
| DOI |
10.1115/ipack2015-48086
doi
|
| 其它 |
期刊:Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays 作者:Ruiyang Liu; HoHyung Lee; Seungbae Park; Xiaojie Xue 出版日期:2015-11-19 |
| 求助人 | |
| 下载 | 该求助完结已超 24 小时,文件已从服务器自动删除,无法下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)