| 标题 |
Microstructural evolution, residual stress, and mechanical property heterogeneity of high-aspect-ratio TGV copper interconnects fabricated by laser-assisted wet etching |
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| DOI | |
| 其它 |
期刊:Journal of Alloys and Compounds 作者:Miao Wang; Jihua Zhang; Wenlei Li; Libin Gao; Hongwei Chen; et al 出版日期:2026-07-20 |
| 求助人 | |
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(2025-6-4)