| 标题 |
Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging, and Manufacturing Technology 作者:J. Myers; Xiaoxian Zhang; Yonghao Xiu; Yuying Wei; J. Williamson; et al 出版日期:2015-07-30 |
| 求助人 | |
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(2025-6-4)