| 标题 |
Molecular Dynamics Study on Plasma-Surface Interactions of SiCN Dielectrics for Wafer-to-Wafer Hybrid Bonding Process |
| 网址 | |
| DOI | |
| 其它 |
期刊:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 作者:Seung Ho Hahn; Wooyoung Kim; Donggap Shin; Yongin Lee; Wonyoung Choi; et al 出版日期:2022 |
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(2025-6-4)