| 标题 |
Bioinspired low temperature Cu bonding interfaces with interlocked microstructures to achieve high reliability |
| 网址 | |
| DOI | |
| 其它 |
期刊:Surfaces and Interfaces 作者:Peilin Cao; Cong Wang; Linpeng Liu; Kaiwen Ding; Jiahua He; et al 出版日期:2024-06-05 |
| 求助人 | |
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(2025-6-4)