| 标题 |
Effect of filer content on the thermal characteristics of underfill materials for Ball-Grid-Array component package |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Jang Baeg Kim; Kyung-Yeol Kim; Eun Ha; Taejoon Noh; Seung-Boo Jung 出版日期:2024-11-01 |
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(2025-6-4)