| 标题 |
Free-standing silver nanobelt foils for sintering die bonding of power electronics and its power cycle reliability |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Xinda Wang; Yanli Xu; Wei Guo; Zilong Peng; Hongqiang Zhang; et al 出版日期:2025-07-07 |
| 求助人 | |
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(2025-6-4)