| 标题 |
 A 0.29pJ/b 5.27Tb/s/mm UCIe Advanced Package Link in 3nm FinFET with 2.5D CoWoS Packaging |
| 网址 | |
| DOI | |
| 其它 | Authors: Didem Turker Melek, R. Navinkumar, James Vandersand, Pyare Sarkar, BS Prakash, Adrian Leuciuc, Kevin Geary, Shaojun Ma, Chirag M. Mehta, Basant Bothra, Shashi Jain, Pawan Sabharwal, Ranjan Vaish, Kirti Bhanushali, Yutong Ding, Craig Frost, John Annunziata, Krishanu Sadhu, Dimitris Kyritsis, Jeff Bostak, Ming Li, Steve Williams, Ken Chang | Journal: 2025 IEEE ISSCC | Year: 2025 |
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| 下载 | 该求助完结已超 24 小时，文件已从服务器自动删除，无法下载。 |
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(2025-6-4)
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