| 标题 |
Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging |
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| DOI | |
| 其它 |
期刊:Journal of Adhesion Science and Technology 作者:Muhammad Nubli Zulkifli; Izhan Abdullah; Nurul Hanis Azhan; Azman Jalar 出版日期:2024-05-23 |
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(2025-6-4)