| 标题 |
Low-dielectric polyimide composite films with enhanced thermal, mechanical, and hydrophobic properties via silica aerogel integration |
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| DOI | |
| 其它 |
期刊:Surfaces and Interfaces 作者:Seok Lae Chae; Yujin Noh; In Kim; Hyung-Ho Choi; Young Gyu Jeong 出版日期:2025-05-24 |
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(2025-6-4)