| 标题 |
Novel Temporary Bonding Film and Debonding Method Adapted for the Fabrication Process of Large Size Panel Packages |
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| DOI | |
| 其它 |
期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Motohiro Negishi; Yuta Akasu; Koji Yukimatsu; Emi Miyazawa; Tetsuya Enomoto; et al 出版日期:2026-05-26 |
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(2025-6-4)