| 标题 |
Electromigration modelling of void nucleation in open Cu-TSVs |
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| DOI | |
| 其它 |
期刊:2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 作者:M. Rovitto; W. H. Zisser; H. Ceric; T. Grasser 出版日期:2015 |
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(2025-6-4)