| 标题 |
Competitive failure mechanism and load tolerance of solder joint under thermo-mechano-electrical coupling |
| 网址 | |
| DOI | |
| 其它 |
期刊:Mechanics of Materials 作者:Zhipeng Zhao; Xiaomin Zhang; Zhouzhi Wu; Yuan Liang; Deqiang Yin 出版日期:2021-12-01 |
| 求助人 | |
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(2025-6-4)