| 标题 |
Process-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of epoxy molding compounds for accurate warpage prediction in advanced semiconductor packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Today Advances 作者:Jeong-Hyeon Baek; Woong-Kyoo Yoo; Woo-Jin An; Jun-Seop Song; Gyung-Hwan Oh; et al 出版日期:2026-06-01 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)