| 标题 |
Die-To-Wafer Hybrid Bonding Technology down to 1 μm pitch for Multi-Die Stacking Integration |
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| DOI | |
| 其它 |
期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Melissa Najem; Agathe Lerat; Carine Ladner; Loic Sanchez; Julien Diaz; et al 出版日期:2026-06-18 |
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(2025-6-4)