| 标题 |
Physical and Barrier Properties of Plasma-Enhanced Chemical Vapor Deposited α-SiC:H Films from Trimethylsilane and Tetramethylsilane |
| 网址 | |
| DOI | |
| 其它 |
期刊:Japanese Journal of Applied Physics 作者:Chiu-Chih Chiang; Mao-Chieh Chen; Chung-Chi Ko; Zhen-Cheng Wu; Syun-Ming Jang; et al 出版日期:2003-07-15 |
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(2025-6-4)