| 标题 |
Electrodeposition of FeNiCoCrMn high-entropy alloys on copper foam for enhanced hydrogen evolution reaction——influence of additives and deposition potential |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Letters 作者:Liu Ju; Wangping Wu; Yicheng Zhou; Yi Zhang; Qinqin Wang 出版日期:2024-08-14 |
| 求助人 | |
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(2025-6-4)