| 标题 |
Dual 3D networks of graphene derivatives based polydimethylsiloxane composites for electrical insulating electronic packaging materials with outstanding electromagnetic interference shielding and thermal dissipation performances |
| 网址 | |
| DOI | |
| 其它 |
期刊:Chemical Engineering Journal 作者:S. Anand; Minh Canh Vu; Dineshkumar Mani; Jun‐Beom Kim; Tae‐Hyeong Jeong; et al 出版日期:2023-02-20 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)