| 标题 |
 Thermal fatigue failure mechanism in the joint of nano Cu/Ti–Si3N4 ceramic substrates after thermal fatigue test |
| 网址 | |
| DOI | |
| 其它 |
期刊：Ceramics International 作者：Chenglai Xin; Mingchang Zhang; Qingyuan Wang; Dongya Li; Zhenliang Ma; Zhaoguo Yuan 出版日期：2024 |
| 求助人 | |
| 下载 |
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