| 标题 |
Isothermal Aging Dependent Anand Parameters of SAC305 Lead Free Solder at Extreme High Temperatures |
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| DOI | |
| 其它 |
期刊:Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 作者:KM Rafidh Hassan; M. Alam; Jing Wu; J. Suhling; P. Lall 出版日期:2020-07-01 |
| 求助人 | |
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(2025-6-4)