| 标题 |
High-temperature electronic packaging for power modules: advances in sintering and transient liquid phase bonding technologies |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Kai Cao; Jianhao Wang; Zehou Li; Jing Zhang; Yang Liu 出版日期:2025-09-27 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)