| 标题 |
Influences of an electrodeposited copper seed layer on the microstructures and surface characteristics of the (111)-oriented nanotwinned copper foils |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of The Taiwan Institute of Chemical Engineers 作者:Hsiang-Sheng Wei; Hsu Tsou; Hao-Yu Ku; Yi-Hung Hsuan; Kai‐Yu Tseng; et al 出版日期:2026-01-23 |
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(2025-6-4)