| 标题 |
Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Guigen Ye; Xuejun Fan; Guoqi Zhang 出版日期:2022-03-18 |
| 求助人 | |
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(2025-6-4)