| 标题 |
Location-Dependent Microstructure and Mechanical Properties Evolution of TGV-Cu via an EBSD–Nanoindentation Co-Localization Characterization |
| 网址 | |
| DOI | |
| 其它 |
期刊:Electronic Components and Technology Conference 作者:Jun-Wei Chen; Xiao Hu; Bin Yang; Chao Gu; Xu-Yang Yan; et al 出版日期:2026-05-26 |
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(2025-6-4)