| 标题 |
Physics-based Modeling of Packaging-related Degradation of IGBT Modules |
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| DOI | |
| 其它 |
期刊:2023 IEEE Applied Power Electronics Conference and Exposition (APEC) 作者:Yichi Zhang; Yi Zhang; Shuai Zhao; Bo Yao; Huai Wang 出版日期:2023-03-19 |
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(2025-6-4)