| 标题 |
Low Temperature Wafer Level Hybrid Bonding Enabled by Advanced SiCN and Surface Activation |
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期刊:2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 作者:Fumihiro Inoue; Atsushi Nagata; Junya Fuse; Sodai Ebiko; Ryosuke Sato; et al 出版日期:2024-06-27 |
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(2025-6-4)