| 标题 |
Enhanced heat conduction in diamond/copper composites via interconnected structures: Machine learning molecular dynamics simulation |
| 网址 | |
| DOI |
10.1016/j.ijthermalsci.2025.110501
doi
|
| 其它 |
期刊:International Journal of Thermal Sciences 作者:Bin Liu; Zhiguo Tian; А. А. Баринов; Moran Wang 出版日期:2025-11-25 |
| 求助人 | |
| 下载 |
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(2025-6-4)