| 标题 |
55‐1: Integrated Through Glass Via (TGV) Technology for Advanced Co‐Packaged Optics (CPO) Development |
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| DOI | |
| 其它 |
期刊:SID Symposium Digest of Technical Papers 作者:Jia-Hong Ye; Ching-Liang Huang; Wen-Ching Sung; Shih-Hsiung Lin; Sung-Yu Su; et al 出版日期:2026-06-01 |
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(2025-6-4)