| 标题 |
All-Organic Aramid Films with High Temperature Resistance and Electrical Insulation by Introducing Interfacial Hydrogen Bonds |
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| DOI | |
| 其它 |
期刊:ACS Applied Materials & Interfaces 作者:Wenjin Hu; Xin Li; Jianping Xiang; De‐xiang Sun; Nan Zhang; et al 出版日期:2025-02-06 |
| 求助人 | |
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(2025-6-4)