| 标题 |
Reduction of Temperature in Layered Structure of Transceiver by Heat Conduction through Thermal Simulation |
| 网址 | |
| DOI | |
| 其它 |
期刊:2022 International Conference on Electrical Engineering and Photonics (EExPolytech) 作者:Muzammal Amin; Muhammad Atif; Abdul Latif 出版日期:2022-10-20 |
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(2025-6-4)