| 标题 |
[高分]
 Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs |
| 网址 | |
| DOI |
10.1115/ipack2019-6347
doi
|
| 其它 |
期刊：ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 作者：Kourosh M. Kalayeh; Natalie Hernandez; Nathan Blattau; Craig Hillman 出版日期：2019-10-07 |
| 求助人 | |
| 下载 | 求助已完成，仅限求助人或该文件上传人下载。 |
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