| 标题 |
Power Integrity Design of Mobile 3D-IC Based on the Allocation of Optimal Number of TSV, BGA, and Via |
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| DOI | |
| 其它 |
期刊:2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 作者:Hyunwoong Kim; Seonghi Lee; Dongryul Park; Jungil Son; Yongho Lee; et al 出版日期:2023 |
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(2025-6-4)