| 标题 |
High-strength hermetic bonding of fused silica via ultrafast laser microwelding for robust glass microfluidic chips |
| 网址 | |
| DOI | |
| 其它 |
期刊:Optics Express 作者:Jian Sun; Danyang Li; Siqi Wan; Jiangnan He; Zhanlin Bao; et al 出版日期:2026 |
| 求助人 | |
| 下载 |
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(2025-6-4)