| 标题 |
Thermal management of on-chip hot spots and 3D chip stacks |
| 网址 | |
| DOI | |
| 其它 |
期刊:2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems 作者:A. Bar-Cohen 出版日期:2009-11-01 |
| 求助人 | |
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(2025-6-4)